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AS1116
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Notes
Electrical Parameters
V DD to GND
-0.3
7
V
Input Voltage Range
Current
All other pins to GND
DIG0:DIG7 Sink Current
SEGA:SEGG, SEGDP
-0.3
7 or
V DD + 0.3
500
100
V
mA
mA
Input Current (latch-up immunity)
±100
mA
Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge
Digital outputs
All other pins
1000
1000
V
V
Norm: MIL 833 E method 3015
Thermal Information
Thermal Resistance Θ JA
88
30.5
oC/W
oC/W
on PCB, QSOP-24 package
on PCB, TQFN(4x4)-24 package
Temperature Ranges and Storage Conditions
Junction Temperature
+150
°C
Storage Temperature
-55
+150
oC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 “Moisture/Reflow
Package Body Temperature
+260
oC
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages
is matte tin (100% Sn).
Humidity non-condensing
5
85
%
Moisture Sensitive Level
QSOP-24 package
TQFN(4x4)-24 package
1
3
%
%
Represents a max. floor life time of unlimited
Represents a max. floor life time 168h
Revision 1.08
3 - 23
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